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| Reflexlichtschranke Reflective Interrupter SFH 9202 Wesentliche Merkmale * Optimaler Arbeitsabstand 1 mm bis 5 mm * IR-GaAs-Lumineszenzdiode in Kombination mit einem Si-NPN-Fototransistor * Tageslichtsperrfilter * Geringe Sattigungsspannung * Sender und Empfanger galvanisch getrennt * Lotmethode: IR-Reflow Loten * Vorbehandlung nach JEDEC Level 4 Anwendungen * * * * Positionsmelder Endabschalter Drehzahluberwachung Bewegungssensor Bestellnummer Ordering Code Q62702P5039 Q62702P5009 Q62702P5010 Q62702P5472 Q62702P5435 Features * Optimal operating distance 1 mm to 5 mm * IR-GaAs-emitter in combination with a Silicon NPN phototransistor * Daylight cut-off filter * Low saturation voltage * Emitter and detector electrically isolated * Soldering Methode: IR Reflow Soldering * Preconditioning acc. to JEDEC Level 4 Applications * * * * Position reporting End position switch Speed monitoring Motion transmitter Typ Type SFH 9202 SFH 9202-2/3 SFH 9202-3/4 SFH 9202-4/5 SFH 9202-5/6 ICE [mA] (IF = 10 mA, VCE = 5 V, d = 1 mm) 0.063 ... 0.8 0.063 ... 0.2 0.10 ... 0.32 0.16 ... 0.50 0.25 ... 0.80 2004-09-23 1 SFH 9202 Grenzwerte Maximum Ratings Bezeichnung Parameter Sender (GaAs-Diode) Emitter (GaAs diode) Sperrspannung Reverse voltage Vorwartsgleichstrom Forward current Verlustleistung Power dissipation Empfanger (Si-Fototransistor) Detector (silicon phototransistor) Dauer-Kollektor-Emitter-Sperrspannung Continuous collector-emitter voltage Kollektor-Emitter-Sperrspannung, (t 1 min) Collector-emitter voltage, (t 1 min) Emitter-Kollektor-Sperrspannung Emitter-collector voltage Kollektorstrom Collector current Verlustleistung Total power dissipation Reflexlichtschranke Light Reflection Switch Lagertemperatur Storage temperature range Umgebungstemperatur Ambient temperature range Verlustleistung Power dissipation Elektrostatische Entladung Electrostatic discharge Umweltbedingungen / Environment conditions Symbol Symbol Wert Value Einheit Unit VR IF Ptot 5 50 80 V mA mW VCE VCE VEC IC Ptot 16 30 7 10 100 V mA mW Tstg TA Ptot ESD - 40 ... + 100 - 40 ... + 100 150 2 C mW KV 3 K3 acc. to EN 60721-3-3 (IEC 721-3-3) 2004-09-23 2 SFH 9202 Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Sender (GaAs-Diode) Emitter (GaAs diode) Durchlaspannung Forward voltage IF = 50 mA Sperrstrom Reverse current VR = 5 V Kapazitat Capacitance VR = 0 V, f = 1 MHz Warmewiderstand1) Thermal resistance1) Empfanger (Si-Fototransistor) Detector (silicon phototransistor) Kapazitat Capacitance VCE = 5 V, f = 1 MHz Kollektor-Emitter-Reststrom Collector-emitter leakage current VCE = 20 V Fotostrom (Fremdlichtempfindlichkeit) Photocurrent (outside light density) VCE = 5 V, Ev = 1000 Lx Warmewiderstand1) Thermal resistance1) Symbol Symbol Wert Value Einheit Unit VF 1.25 ( 1.65) V IR 0.01 ( 1) A CO 25 pF RthJA 270 K/W CCE 5 pF ICEO 1 ( 50) nA IP 1 mA RthJA 270 K/W 2004-09-23 3 SFH 9202 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Reflexlichtschranke Light Reflection Switch Kollektor-Emitterstrom Collector-emitter current Kodak neutral white test card, 90% Reflexion IF = 10 mA; VCE = 5 V; d = 1 mm Kollektor-Emitter-Sattigungsspannung Collector-emitter saturation voltage Kodak neutral white test card, 90% Reflexion IF = 10 mA; d = 1 mm; IC = 20 A 1) 1) Symbol Symbol Wert Value Einheit Unit ICE min. ICE max 63 800 A A VCE sat 0.15 ( 0.6) V Montage auf PC-Board mit > 5 mm2 Padgroe Mounting on pcb with > 5 mm2 pad size d Reflector with 90% reflexion (Kodak neutral white test card) OHM02257 2004-09-23 4 SFH 9202 Schaltzeiten (TA = 25 C, VCC = 5 V, IC = 100 A1), RL = 1 k) Switching Times RL F C VCC Output OHM02258 Bezeichnung Parameter Einschaltzeit Turn-on time Anstiegzeit Rise time Ausschaltzeit Turn-off time Abfallzeit Fall time 1) Symbol Symbol Wert Value 40 30 45 40 Einheit Unit s s s s tein ton tr taus toff tf IC eingestellt uber den Durchlastrom der Sendediode, den Reflexionsgrad und den Abstand des Reflektors vom Bauteil (d) IC as a function of the forward current of the emitting diode, the degree of reflection and the distance between reflector and component (d) 1) 2004-09-23 5 SFH 9202 Collector Current C 100 I I Cmax C------------- = f ( d ) OHO02255 Permissible Power Dissipation for Diode and Transistor Ptot = f (TA ) Ptot 160 mW OHL00945 Switching Characteristics t = f (RL) TA = 25 C, IF = 10 mA 10 3 t s t on t off OHO01367 Total power dissipation C max % 80 120 100 80 40 Detector Emitter 60 10 2 60 40 20 Kodak neutral white test card Mirror 0 0 1 2 3 4 mm 5 d 20 0 10 1 0 10 0 20 40 60 80 C 100 10 1 TA k RL 10 2 Max. Permissible Forward Current IF = f (TA) IF 120 mA 100 OHL00986 CCE = f (VCE), TA = 25 C, f = 1 MHz 20 C CE pF 15 OHO00496 Transistor Capacitance (typ.) Collector Current IC = f (IF), spacing d to reflector = 1 mm, 90% reflection 300 C A OHO01324 80 200 60 10 40 100 5 VCE = 5 V 20 0 0 20 40 60 80 C 100 TA 0 -2 10 10 -1 10 0 10 1 V 10 2 V CE 0 0 4 8 12 16 mA 20 F Forward Voltage (typ.) of the Diode VF = f (T) 1.30 VF V 1.25 OHO02256 Relative Spectral Emission of Emitter (GaAs) Irel = f () and Detector (Si) Srel = f () 100 rel S rel % 80 OHO00786 Output Characteristics (typ.) IC = f (VCE), spacing to reflector: d = 1 mm, 90% reflection, TA = 25 C 0.6 OHO01326 C mA 0.5 F = 25 mA F = 20 mA 0.4 1.20 F = 20 mA 10 mA 5 mA 60 F = 15 mA 0.3 Detector 1.15 40 1.10 0.2 20 F = 10 mA 1.05 0.1 Emitter F = 5 mA 1 -40 -20 0 20 40 60 C T 100 0 700 800 900 1000 nm 1100 0 0.1 10 0 10 1 V VCE 2004-09-23 6 SFH 9202 Mazeichnung Package Outlines 6.2 (0.244) 0...0.1 (0...0.004) 0.2 M A 0.15 (0.006) 0.13 (0.005) (0.05 (0.002) typ.) 5.8 (0.228) 3.4 (0.134) 3.0 (0.118) (5) 4.2 (0.165) 3.8 (0.150) B A (1.2 (0.047) typ.) 0.5 (0.020) 0.3 (0.012) (0.4 (0.016) typ.) 1 2 3 6 5 4 Chip Positionen 0.1 M B Empfanger/Receiver GPLY0504 Type SFH 9202 1 Anode 23 - Emitter (0.1 (0.004) typ.) Sender/Emitter 1.27 (0.050) Raster (spacing) 2.54 (0.100) Raster (spacing) 4 Collector 56 - Cathode Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 2004-09-23 7 2.1 (0.083) 1.7 (0.067) SFH 9202 Empfohlenes Lotpaddesign Recommended Solder Pad IR-Reflow Loten IR REflow Soldering 1.27 (0.050) 0.6 (0.024) 1.2 (0.047) Padgeometrie fur verbesserte Warmeableitung Paddesign for improved Heat dissipation 1.27 (0.050) Cu-Flache >5 mm 2 Cu-area >5 mm 2 Lotstopplack Solder resist 3.9 (0.154) OHPY0030 Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 2004-09-23 8 SFH 9202 Lothinweise Soldering Conditions Bauform Type Drypack Level acc. to IPS-stand. 020 4 Tauch-, Schwalllotung Dip, Wave Soldering Reflowlotung Reflow Soldering Kolbenlotung Iron Soldering (Iron temp.) Peak Temp. Max. Time in Peak Temp. Max. Time (solderbath) peak zone (package in Peak temp.) Zone n. a. - 245 C 10 sec. SFH 9202 n.a. Bitte Verarbeitungshinweise fur SMT-Bauelemente beachten! Please observe the handling guidelines for SMT devices! IR-Reflow Lotprofil IR Reflow Soldering Profile (nach IPC 9501) (acc. to IPC 9501) 300 C T 250 240-245 C 10-40 s 183 C 120 to 180 s 150 OHLY0597 200 ramp-down rate up to 6 K/s defined for Preconditioning: up to 6 K/s ramp-up rate up to 6 K/s 100 50 defined for Preconditioning: 2-3 K/s 0 0 50 100 150 t 200 s 2 2004-09-23 9 SFH 9202 Gurtung / Polaritat und Lage siehe Dokument: Short Form Katalog: Gurtung und Verpackung - SMT-Bauelemente - Gehause:SMT RLS Methode of Taping / Polarity and Orientation see document: Short Form Catalog: Tape and Reel SMT-Components - Package: SMT-RLS Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2004-09-23 10 |
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